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Mike Chudzik, Ph.D.
Dr. Chudzik is a Vice President of Technology at Applied Materials. He manages teams of device integrators, process and device engineers and program managers to execute on large scale device fabrication projects. Prior to Applied Materials, Mike was at IBM for 14 years where he led teams in the R&D of advanced semiconductor process integration. He received his Ph.D. in electrical engineering at Northwestern University.
As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.
At our upcoming Logic Master Class, experts from Applied and the industry will shed light on the innovations needed to enable advanced logic to further scale and deliver improvements in PPACt. In this blog I give a preview of what we’ll be discussing related to transistor design and scaling challenges.
New facility will offer the industry’s most advanced R&D environment for working with the extended semiconductor ecosystem to accelerate readiness of new materials, methods and devices for computing applications including Big Data and Artificial Intelligence.