New Playbook

sparse sampling on a wafer

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

The patterning challenges of today’s most advanced logic and memory chips can be solved with a new playbook that takes the industry from optical target-based approximation to actual, on-device measurements; limited statistical sampling to massive, across-wafer sampling; and single-layer patterning control to integrative multi-layer control. Applied’s new PROVision® 3E system is designed to enable this new playbook.

Introducing a New Playbook in Process Control

Applied Materials is reinventing process control with a new solution, unveiled today, that uses Big Data and AI to find yield-killing defects better, faster and more cost effectively than legacy approaches. The solution allows chipmakers to accelerate yields and time to market of semiconductor process technologies and fabs. 

Trends Accelerating the Semiconductor Industry in 2021 and Beyond

2020 will be remembered most for the challenges of COVID-19. In the world of technology, it will be remembered for accelerating digital transformations that would have taken many more years to play out. Entering 2021, the dependency between the global economy and semiconductors is greater than it’s ever been. At the same time, the way chips are being made is changing as traditional Moore’s Law scaling slows. Applied Materials is dedicated to driving new ways to help our customers continue to deliver improvements in chip power, performance and cost, in record time.