The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

At the Applied Materials Master Class today, we highlight two fast-growing and highly enabling areas of the semiconductor industry. “ICAPS” silicon powers billions of new devices on the edge—including electric vehicles. No longer an afterthought, packaging now enables the benefits associated with Moore’s Law to continue even as 2D scaling slows. Today’s class demonstrates that the AI Era requires innovation across a wide range of technologies, from the edge to the cloud.

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as Classic Moore’s Law Scaling Slows

Applied’s upcoming, Sept. 8 Master Class features the topic of heterogeneous design and advanced packaging. In this blog I preview why the role of packaging has evolved from simply protecting and connecting chips to circuit boards, to now being a competitive imperative for the world’s leading semiconductor and systems companies.

Not All Semiconductor Innovation Occurs at the Leading Edge

As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.

Leading Chipmakers Aim to Make New Fabs More Sustainable

In this blog, I look at ways Applied Materials is working with leading customers who wish to sustainably increase production to meet the world’s growing need for semiconductors. About half of the opportunity lies in the sub-fab, the often-overlooked world of support equipment below the production floor that consumes around half of the energy needed by modern fabs.