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Buvna Ayyagari-Sangamalli heads the Design Technology team at Applied Materials. With a career in various roles from Design Engineering to development of Customer IP Subsystems, she is intimately familiar with design challenges. At Synopsys she played a pivotal role in growing the IP business, where she led the IP Applications Engineering team and launched Customer IP Subsystems for AI, Automotive, IoT and other segments. Prior to that, she played a critical role in defining low-power EDA design methodologies. At Intel she worked on various mobile, desktop and processor chips. Her well-rounded 20 years in the semiconductor industry straddled architecture, design, EDA and IP.
The serial interaction between siloed parts of the industry that produced the computing eras of the past—mainframe/minicomputer, PC/Internet, mobile/social media—will not be sufficient to fuel the next era of computing. Instead, we need codesign from materials to systems to enable the AI Era.
AI is one of the most exciting and most pervasive inflections to happen in our lifetime. But it is challenging the entire design ecosystem – from materials to systems – in a way that we haven’t experienced before.