AI is one of the most exciting and most pervasive inflections to happen in our lifetime. But it is challenging the entire design ecosystem – from materials to systems – in a way that we haven’t experienced before.
Back in July, Applied Materials announced that we’d been selected by the Defense Advanced Research Projects Agency (DARPA) to develop technology for AI. At the core of this project are the efforts of Applied Materials, Arm and Symetrix to develop a correlated electron switch. This of course begs the question, “what the heck is a correlated electron?”
Many of us know what it’s like to put in long hours at work. But what we may not realize is that some of our colleagues are working 15+ hours a day risking their own safety to help those in need of support and resources.
Applied Materials recently joined the United States Advanced Ceramics Association to deepen our connection with suppliers and application developers, and explore potential areas where our materials engineering leadership can help enable the next major technology inflections.
The ability to detect and identify defects becomes increasingly difficult as chips continue to shrink. In this blog, I discuss a new approach to Defect Review Scanning Electron Microscopy that increases sensitivity of defect identification and isolates true defects from the noise.
I recently sat down for a video interview with G. Dan Hutcheson, CEO of VLSIresearch, to discuss why the industry is moving to new memory solutions and what strategies are being implemented to alleviate the memory bottleneck.