Our recent Open Innovation Workshop brought together quantum technology leaders from across the ecosystem to identify key challenges in quantum information systems and explore opportunities for collaboration. The central theme that emerged from the day is that quantum is about so much more than computing; there are many applications in areas like sensing, metrology and communications encryption on the near-term horizon.
Metrology allows process engineers to see the results of process steps. Today, driving improvements in chip performance, power and area/cost (PPAC) requires novel architectures and exotic material stacks. This is introducing new sources of atomic-scale variation that can negatively impact chip performance and yield. It is becoming imperative to “watch” the deposition process as it occurs to control variability and deliver repeatable performance.
Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.