Where can the industry test codesigned chip innovations for the AI Era—to accelerate the future of computing, from materials to systems? The answer is: our new Materials Engineering Technology Accelerator (META Center), which—I’m delighted to announce—is now open for collaboration.
The serial interaction between siloed parts of the industry that produced the computing eras of the past—mainframe/minicomputer, PC/Internet, mobile/social media—will not be sufficient to fuel the next era of computing. Instead, we need codesign from materials to systems to enable the AI Era.
The AI Era is fueling an explosion of data, while Moore’s Law is no longer the predictable engine of progress that it once was. With opportunities and challenges of this magnitude, we need to open the strategic planning lens and decide where we want to be in 2029.
Applied's Sree Kesapragada and Miller Allen, discuss the Endura Cirrus HTX which meets chipmakers’ copper interconnect patterning needs by extending the TiN metal hardmask —the industry’s material of choice — to the 10nm and below nodes.