Leading technology CEOs and industry thought leaders from across the computing ecosystem convened in San Francisco earlier this week at the second AI Design Forum™ to discuss the future of computing—from materials to systems. What was made clear from the thought-provoking keynotes and many sideline discussions is that AI and Big Data create tremendous growth opportunities for the industry, but to realize their potential requires new levels of innovation.
The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.
Applied Materials will take part in several presentations and panel discussions that showcase how materials engineering is enabling technology inflections.
As scaling continues, device complexity and shrinking dimensions are demanding unprecedented selectivity and etch precision as well as a much gentler process to avoid damaging fragile features.
Applied has introduced a new method of tungsten gap fill for logic contacts and local interconnects that will help improve the yield of next-generation devices. Learn why it’s so significant.
New materials engineering innovations significantly reduce contact resistance, making it possible to extend tungsten metallization to next-generation devices.
